한국 반도체산업 기술발전 사례를 통한 기술역량발전의 패턴분석

목차

1. 서 론

2. 분석의 틀
2.1. 기술역량의 구성요소들
2.2. 기술역량발전 패턴의 다양성과 요인들
2.2.1 국가특수 요인: 한국의 늦은 산업화와 기본적 제약조건들
2.2.2 산업특수 요인: 반도체 산업과 DRAM
2.2.3 기업특수 요인들: 재벌체제와 반도체 제조업
2.3. 기술추격 주자들의 기술학습 환경변화 궤적

3. 한국 반도체산업의 기술발전 사례분석
3.1. 성숙기술의 획득과 국제적인 수직적 기술협력
3.2. 성장기술의 획득과 국제적 협력 및 견제의 혼재
3.2.1 준 글로벌 네트워킹과 생산능력 및 투자능력의 성장
3.2.2 갈등의 고조와 혁신능력의 발아
3.3. 태동기 기술의 획득과 전략적 제휴

4. 요약 및 결론

<참고문헌>

본문내용

iness School Press, Mass.; Lim, Youngil (1999), Technology and Productivity: the Korean Way of Learning and Catching up, Cambridge, Mas: The MIT Press.
〈부록 2〉1990년대 국내 반도체 3사의 해외 전략적 제휴와 해외 직접투자
firms
type
partner or regional area
product items and collaboration contents
year
Sam-
sung
DI (US$ 1.3 billion)
in Austin, Texas, USA
DRAM (16M, 64M) production
Mar. 1996
M&A (new name: Samsung Microwave Semiconductor)
Harris Microwave Semiconductor
.compound semiconductor
May 1993
strategic alliance
in Portugal with
TI (Texas Instrument)
.joint production
- Samsung: DRAM (4M, 16M)
- TI: Logic
Jan. 1994
strategic alliance
MT (Micron Technology)
.mutual OEM supply and
technology cooperation
- Samsung: 16M synchronous DRAM
- MT: triple-port asynchronous DRAM,
EEPROM, SRAM
Nov. 1993
strategic alliance
NEC
.specification harmonization of 16M
synchronous DRAM and mutual OEM
supply.
.joint development and sales of 16 bit
microcontroller
.joint production of DRAM
.technology exchange of 256M DRAM
Jan. 1996
Nov. 1995
Feb. 1995
Mar. 1994
strategic alliance
Toshiba
.technology exchange
- Samsung: DRAM technology
- Toshiba: chip technology for Bi-polar
and HDTV
.joint development: drive IC for LCD
.cross license of NAND flash memory
Jan. 1995
Nov. 1993
Dec. 1992
strategic alliance
SGS-Thomson
.joint development for 16 bit DSP and
32bit MICOM
Jan. 1996
M&A (US $9 million)
Integrated Telecom
.chip for ATM
Jan. 1995
strategic alliance
Sun Mirosystems
.comprehensive technology alliance
for Java one
May 1996
strategic alliance
General Instrument
.joint development of chip for multimedia
July 1995
strategic alliance
General Electronic
.joint development and technology
exchange of chip for HDTV
Nov. 1993
strategic alliance
Array Microsystem
.stock share and joint development of
digital signal processor
Apr. 1993
strategic alliance
Siemens
.joint development of IC for smart card
Nov. 1995
Hyun-
dai
DI (US$ 1.3 billion)
in Eugene, Oregon, USA
.DRAM (16M, 64M) production
Feb. 1996
M&A (new name: Symbios Logic)
AT&T GIS
.non-memory semiconductor
(NCR MPD)
Nov. 1994
DI (US$ 1.4 billion)
in Dunfermline, Scotland, UK
.DRAM (64M, 256M) production
Oct. 1996
strategic alliance
Fujitsu
.mutual cooperation of
production/technology/sales
Oct. 1993
strategic alliance
MT (Micron Technology)
.cross license
Mar. 1993
strategic alliance
SGS-Thomson
.joint development of IC for smart card
Jun. 1996
LG
DI (US$ 1.9 billion)
in Wales, UK
.production of DRAM and MPACT
Oct. 1996
JI (US$ 1.25 billion)
in Malaysia with Hitachi
.joint production of DRAM with Hitachi
NA
strategic alliance
Rambus
.technology cooperation for 16M, 64M
rambus DRAM
Apr. 1994
Oct. 1996
strategic alliance
Siemens
.technology licensing and OEM supply
Jun. 1995
strategic alliance
Hitachi
.cooperation of production/technology/
OEM for 4M and 16M DRAM
1990
Oct. 1993
* DI: direct investment, JI: joint investment, NA: not available.
자료: 한국반도체조합 자료(1996); 조현대(1997),「기술추격국의 기술획득과 전략적 제휴: 모형개발과 사례분석」, 과학기술정책관리연구소.

키워드

반도체산업기술발전사례,   기술역량의구성요소들,   기술역량발전패턴의다양성,   재벌체제와반도체제조업,   국제적인수직적기술협력,   글로벌네트워킹과생산능력,   기술의획득과전략적제휴,   성숙기술의획득