SMD Package Styles

소개글

SMD Package Styles에 대한 보고서 자료입니다.

목차

1. BCC : Bump Chip Carrier
2. BGA : Ball Grid Array
3. BQFP : Bumpered Quad Flat Pack
4. CABGA/SSBGA : Chip Array/Small Scale Ball Grid Array
5. CBGA : Ceramic Ball Grid Array
6. CCGA : Ceramic Column Grid Array [A column of solder]
7. CERPACK : Ceramic Package
8. CFP : Ceramic Flat Pack
9. CGA : Column Grid Array
10. CLCC : Ceramic Leadless Chip Carrier Packages

본문내용

Carrier (Ceramic) DLCC Graphic
20. DMP : Dual In-line Mini Molded Package
21. DQFN : Depopulated Quad Flat-pack; No-leads
22. EPTSSOP : Thin Shrink Small Outline Exposed Pad Plastic Packages
23. ETQFP : Extra Thin Quad Flat Package
24. FBGA : Fine-pitch Ball Grid Array
25. FCBGA : Flipchip BGA
26. FCPBGA : Flip Chip Plastic BGA
27. FleXBGA : Flexible Ball Grid Array
28. FLP : Flat Lead Package
29. fpBGA : Fine Pitch Ball Grid Array
30. HSBGA : Heat Slug Ball Grid Array [copper slug added to reduce thermal resistance]
31. HTSSOP : Heatsink Thin Shrink Small Outline Package
32. HVQFN : Heatsink Very-thin Quad Flat-pack; No-leads
33. HVSON : Heatsink Very-thin Small Outline; No-leads
34. HWQFN : Heatsink Very-Very-thin Quad Flat-pack; No-leads
35. HWSON : Heatsink Very-Very-thin Small Outline package; No leads
36. HXQFN : Heatsink eXtremely-thin Quad Flat-pack; No-leads
37. HXSON : Heatsink eXtremely Small Outline Package; No leads
38. JDIP : J-Leaded Dual In-Line
39. JLCC : J-Leaded Chip Carrier (Ceramic) J-Lead Picture
40. LBGA : Low-Profile Ball Grid Array
41. LCC : Leaded Chip Carrier
42. LCC : Leaded Chip Carrier Un-formed
43. LCCC : Leaded Ceramic Chip Carrier;
44. LFBGA : Low-Profile, Fine-Pitch Ball Grid Array
45. LGA : Land Grid Array LGA Graphic [Pins located on Mother board, not the device]
46. LLCC : Leadless Chip Carrier
47. LQFP : Low-profile Quad Flat pack
48. MLP : Micro Lead-frame Package
49. MQFP : Metric Quad Flat Pack [high pin count QFP]
50. MSOP : Mini Small Outline Plastic Packages
51. ODFN : Optical Dual Flat No-Lead Plastic Package
52. PBGA : Plastic Ball Grid Array
53. PLCC : Plastic Leaded Chip Carrier
54. POS : Package on Substrate
55. PQFP : Plastic Quad Flat Pack
56. PSOP : Plastic Small-Outline Package
57. QFN : Quad Flat No-Lead
58. QFP : Quad Flat pack
59. QSOP : Quarter Size Outline Package
60. SBGA : Super BGA - above 500 Pin count [Cavity down die]
61. SDMP : Shrink Dual In-line Mini Molded Package
62. SO Flat Pack : Small Outline Flat Pack IC
63. SOIC : Small Outline IC
64. SOJ : Small-Outline Package [J-Lead]
65. SOLIC : Small Outline Large Integrated Circuit (Gull-Wing Lead Wide Body)
66. SON : Small-Outline No-leads [leadless package]
67. SOP : Small Out-line Package
68. SSOP : Shrink Small-Outline Package
69. SOT : Small Outline Transistor Plastic Package
70. TBGA : Tape Ball Grid Array [Cavity-down thermally enhanced Flip Chip]
71. TDFN : Thin Dual Flat No-Lead Plastic Package
72. TEPBGA : Thermally Enhanced Plastic Ball Grid Array
73. TFBGA : Thin profile Fine-pitch Ball Grid Array
74. TQFN : Thin Quad Flat No-Lead Plastic Package
75. TQFP : Thin Quad Flat Pack
76. TSOP : Thin Small-Outline Package
77. TSSOP : Thin Shrink Small-Outline Package
78. TSOT : Thin Small Outline Transistor Plastic Package
79. TVSOP : Thin Very Small-Outline Package
80. UTDFN : Ultra Thin Dual Flat No-Lead Plastic Package
81. VFBGA : Very thin Fine-pitch Ball Grid Array
82. VSSOP : Very thin Shrink Small Outline Package

키워드

SMD 패키지 타입 과제,   Package type 관련 report,   SMD Package Styles,   SMD 패키지타입