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목차
<PPT>
1. Introduction
2. Method
3. Results
4. Conclusion
<Report>
1. Abstract
2. Introduction
3. Methods
4. Results
5. Discussion
6. Conclusion
7. Reference
1. Introduction
2. Method
3. Results
4. Conclusion
<Report>
1. Abstract
2. Introduction
3. Methods
4. Results
5. Discussion
6. Conclusion
7. Reference
본문내용
Heat generated by electronic devices is fatal to electronic devices. Especially for CPUs, 70 degrees or higher can have a fatal adverse effect on the inside of the system. Therefore, we need to facilitate cooling of electronic devices, and we want to design a CPU liquid cooler, which is the cooling system of the CPU. Our goal is to improve the cooling performance of the CPU liquid cooler by changing the internal shape of the waterblock. It should be noted that the performance is improved by changing the structure of the Fin inside the waterblock. Six preferences have been made to create reliable models in various environments. Before we could change Fin's structure, we had to find the number of optimized Fins. It is intuitive to predict that the more Fin, the more heat exchange with coolant, the lower the CPU's temperature of the CPU. However, there is a problem in which the internal coolant flow becomes unbalanced. It also went through the optimization phase because Fin cannot be created indefinitely. We have used the number of optimized pins to create the optimal design we want. We devise a more optimized model by investigating the streamline distribution while increasing the heat exchange performance by different batches of fin.
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