[신소재공학]반도체 공정에 관하여

소개글

[신소재공학]반도체 공정에 관하여에 대한 보고서 자료입니다.

목차

1. The chip making process

2. Making the Wafer

3. The Mask Making Process

4. Epitaxy

5. Photolithography process

6. Oxidation & Exposure

7. Etch & strip

8. Diffusion & Implant

9. Deposition

10. Oxidation

11. Interconnect - Vias

12. Interconnect – Metallization

13 .Chemical Mechanical Planarization

14. Interconnect – Layers

15. Inspection & Measurement

16. Yield Impact

17. Test, Assembly & Packaging

18. Wafer Probe

19. Memory repair

20. Assembly & Packiging

21. Package Test

본문내용

Making the Wafer
The process
-A seed crystal is suspended in a molten bath of silicon
-It is slowly pulled up and grows into an ingot of silicon
-The ingot is removed and ground down to diameter
-The end is cut off, then thin silicon wafers are sawn off (sliced) and polished
Epitaxy
The growth of an ultra-pure layer of crystalline silicon
Approx 3% of wafer thickness
Contaminant-free for the subsequent construction of transistor

키워드

반도체공정,   반도체,   공정,   신소재공학,   process flow