|
: "Mechanical properites and Solder Joint Reliability of Low-Melting Sn-Bi-Cu Lead Free Solder Alloy" , R&D Rev. of Toyata CRDL, 39-2 (2004), 49.
12. Seong jun K at al : "Interfacial Reaction and Die attach Properties of Zn-Sn High-Temperature Solders", journal of electronic materials, s11664-008-05
|
|
|
Solder의 사용
2.1.2 Pb Solder의 문제점
2.2 Pb Free Solder
2.2.1 Pb Free Solder 종류 및 비교
2.2.2 Pb Free Solder의 기계적 특성 평가
3. 본론
3.1 Mechanical Bonding Test
3.1.1 Tensile Properties
3.1.2 Shear Properties
3.2 Creep
3.3 Fatigue
4. 결론
5. Reference
|
|
|
Mechanical Energy Conservation
이론적 배경 발췌 Ⅰ. Abstract ……………………………………………………………………………… 3
Ⅱ. Introduction…………………………………………………………………………… 3
Ⅲ. Theoretical Background…
|
|
 |
솔더를 이용한 무연솔더 접합부의 보드레벨 신뢰성에 대한 연구 .한양대학교 대학원(2004).
4. M. McCORMACK*, H.S. CHEN, G.W. KAMMLOTT, and S. JIN : Significantly Improved of Bi-Sn Solder Alloys Mechanical Properties by Ag-Doping, Journal of Electronic Materials, VoI. 26, No. 8, (1997).
5.
|
|
메뉴펼치기
