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: "Mechanical properites and Solder Joint Reliability of Low-Melting Sn-Bi-Cu Lead Free Solder Alloy" , R&D Rev. of Toyata CRDL, 39-2 (2004), 49.
12. Seong jun K at al : "Interfacial Reaction and Die attach Properties of Zn-Sn High-Temperature Solders", journal of electronic materials, s11664-008-05
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Temperature
( )
Thermal
conductivity
(cal/cm s )
Specific Heat
(cal/g· )
Coefficient of
Thermal
Expansion
(106/ )
100
0.120
0.116
13.76
200
0.115
0.125
14.51
300
0.107
0.132
15.36
400
0.098
0.138
15.81
Fig. 4 Step 1, Room Temperature
Fig.5 Step 4. Room Temperature
Fig. 6 Step 8, Room Temperature
Fi
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and future directions (with discussions). J. Quality Technol. 31(1):30-74
Myers, R. H., Montgomery, D. C. (1995). Response surface Methodology. John Wiley & Sons, Inc.
Savage, G. J., Swan, D. A. (2001). Probabilistic robust design with multiple quality characteristics. Quality Engineering 13(4):629-
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and Polyvinyl alcohol. In: Some Monomers, Plastics, and Synthetic
Elastomers, and Acrolein. IARC Working group, feb. 7-13,1978,Lyon, France. World Health Organization
(WHO). International Agerny for Research on Cancer (IARC); Lyon, France. IARC Monographs on the
Evaluation of the Carcinogenic Risk o
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Reliability Analysis(인간신뢰도 분석)
Lack of Database
데이터베이스의 부족
Error Monitoring
에러 감독
Nonindependence of Human Errors
인간에러의 비독립성
Integrating Human and Machine Reliabilities
인간 신뢰도와 기계 신뢰도를 통합하기
Errors in the Organiz
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Pb-Free Solder,
6. F, Hua, Z. Mei and J. Glazer : “Eutectic Sn-Bi as
Alternative to the Pb-free solders” 48th Electronic
Components and Technology Conference, 1998, pp. 277-283
7. Hisaaki Takao , Akira Tamada, Gideo Gasegawa : Mechanical Properties and Solder Joint Reliability of Low-Melting Sn-Bi-
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characteristics of the disabled, crosstabulation analysis to examine the vocational desire.
It is performed factor analysis to verify the reliability and validity of satisfaction factors, analysed using the t-test and regression analysis to verify differences of satisfaction factors according to ge
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