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Lip Gan; Nam Hwang; Statistical and physical analysis of leakage and breakdown failure mechanisms of Cu/low-k interconnects, Physical and Failure Analysis of Integrated Circuits, 2005. IPFA 2005. Proceedings of the 12th International Symposium on the 27 June-1 , pp.267 - 270, July 2005.
[24] Evtukh
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- 페이지 56페이지
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