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์ฐ๊ตฌ๊ฐ ์์ด์ผ ํ๋ค.
5.2 Cu-Al-Mn ์๋ ์คํ์ ๊ฒฐ๋ก
Bi๊ฐ ์ฒจ๊ฐ๋ CuAlMn solder์ ๊ธฐ๊ณ์ ํน์ฑ์ pure Bi๋ณด๋ค ๊ธฐ๊ณ์ ๊ฐ๋๊ฐ 2๋ฐฐ์ ๋ ํฅ์๋จ์ ํ์ธ ํ ์ ์์๋ค. ๋ํ joint reliability test ๊ฒฐ๊ณผ CTE-matched sample joint๋ 200โ ์ด์์ thermal cycling test์์ ์ข์
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evaluation): ๊ต์ก ํ๋ก๊ทธ๋จ์ ๊ฐ๋ฐ์ด๋ ์ํ๊ณผ์ ์์ ๊ทธ ํ๋ก๊ทธ๋จ์ ํจ๊ณผ์ฑ์ ๋์ด๊ธฐ ์ํ ์์ ์ด๋ ๋ณด์์ ๋ชฉ์ ์ผ๋ก ์ํํ๋ ํ๊ฐ
โ ๋ฉํํ๊ฐ(meta-evaluation): ํ๊ฐ ์์ฒด์ ๋ํ ํ๊ฐ. ์ฆ ํ๊ฐ์ ์ ํ์ฑ, ์ ์ฉ์ฑ, ์ค์ฉ์ฑ, ์ ์ ์ฑ์ ๋ํ ํ๊ฐ
โ
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Reliability of Low-Melting Sn-Bi-Cu Lead Free Solder Alloy, R&D review of Toyota CRDL Vol.39 No.2 p.49-56 (2005)
8. Official J. of the European Union, 45-C90E(2002).
9. ๊ฐ์ ์ค : Pb Free Solder ๊ฐ๋ฐ์ ๋ํ ์ฐ๊ตฌ๋ํฅWithdrawal Force Curve of the Wetting, IEEE, Trans. Component and Packaging Technology
์ ์์ฌ ๊ณตํ๋ถ ๋
ผ๋ฌธ|์๋์ ๊ธฐ๊ณ์ ๋ฌผ์ฑ ํ๊ฐ|์๋|์๋๋ง|๊ธฐ๊ณ์ ๋ฌผ์ฑ ํ๊ฐ|Mechanical Properties Evaluation|Alloying Elements Addition|ํ์ฌ ๋
ผ๋ฌธ, ํฉ๊ธ์์ ์ฒจ๊ฐ์ ๋ฐ๋ฅธ ์ ์จ์ฉ Sn-40Bi ์๋์ ๊ธฐ๊ณ์ ๋ฌผ์ฑ ํ๊ฐMechanical Properties Evaluation of Sn-40Bi Solders by All,
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๋ฉ๋ดํผ์น๊ธฐ
