목차
1. Introduction
2. Experiment
3. Data
4. Discussion
5. Conclusions
2. Experiment
3. Data
4. Discussion
5. Conclusions
본문내용
The optimum annealing temperature for the maximum PL yield strongly depends on the film thickness and varies from 800 to 1200 °C.
The PL intensity is directly related to the content of the Si–-N bonds in the SiNx films.
Excessively high annealing temperatures lead to weakened Si–-N bonds
(which effectively control the PL intensity)
in thinner SiNx films, which eventually results in a lower PL intensity.
The PL intensity is directly related to the content of the Si–-N bonds in the SiNx films.
Excessively high annealing temperatures lead to weakened Si–-N bonds
(which effectively control the PL intensity)
in thinner SiNx films, which eventually results in a lower PL intensity.
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