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photoresist.
In 1954, Louis Plambeck, Jr., of Du Pont, develops the Dycryl polymeric letterpress plate 1. what's the photholithography?
2. Process of photolithography
3. Development of photoresist
4. Mask alignment and Exposure
5. Development and Hard baking
6. Etch and Photore
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Etch) Bias and Over Etch
the different in lateral dimensions between the etched mask and the etched pattern
the smaller RL cause the smaller bias
Lateral Etch Ratio (RL) Anisotropy (A)
𝑅_𝐿=(𝐻𝑜𝑟𝑖𝑧𝑜w
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Etching Processing of Ni, NiO and TiO2 thin films, 2008, Pages 26-27
李到, Deposition and Etch characteristicsof IZO thin films, 2009년, Pages 26-27, 41-42
신희성, 플라즈마 식각 공정에서 O2 GAS 를 이용한 건식 세정 및 정전기 제어에 관한 연구, 2011년, Page 40 1. 오른쪽과 같
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Etching of CoFeB Using CO/NH3 in an Inductively Coupled Plasma Etching System, Jong-Yoon Park외 5인, Journal of The Electrochemical Society, 158 1H1-H4 2011
[4] X. Peng. S. Wakeham, A. Morrone, A. Axdal, M. Feldbaum, J. Hwu, T. Boonstra, Y
Chen. and J. Ding: Vaccum 83(2009) 1007.
[5] Evolution of b
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etching, grinding, polishing에 관한 내용
http://kin.naver.com/qna/detail.nhn?d1id=11&dirId=1115&docId=66330192&qb=Z3JhaW4gYm91bmRhcnk=&enc=utf8§ion=kin&rank=1&search_sort=0&spq=1
Effect of Surface Treatments of Titanium on Bond Strength and Interfacial Characterization in Titanium-Ceramic Prosth
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실험 결과 및 고찰
Ⅲ. 실리콘 주형의 제작과 분광기의 제작
1. 반응성 이온 식각 공정(RIE;Reactiva Ion Etching Process)
2. UV 몰딩(UV-molding) 공정을 이용한 분광기의 제작
3. 분광기(Spectroscopic component)의 특성 고찰
Ⅳ. 결 론
Ⅴ. 참고 문헌
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First , I have high understanding about semiconductor and LED process.
Second, I have a lot of experience that set up the new machine .
① In Semiconductor Line , 200/300mm Single Spin Cleaning Machine.
Third , I have a lot of experience that apply new method to Unit Process and development of
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